Chemical content BC68PAS

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Type numberPackagePackage descriptionTotal product weight
BC68PASSOT1061DHUSON37.58400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340681081153126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01450
FillerSilver (Ag)7440-22-40.0924084.000001.21835
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14504
Isobornyl Methacrylate7534-94-30.005505.000000.07252
DieDoped siliconSilicon (Si)7440-21-30.23000100.000003.03270
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.69506
Magnesium (Mg)7439-95-40.014020.500000.18486
Nickel (Ni)7440-02-00.103753.700001.36799
Silicon (Si)7440-21-30.022430.800000.29578
Pure metal layerGold (Au)7440-57-50.001680.060000.02218
Nickel (Ni)7440-02-00.028041.000000.36973
Palladium (Pd)7440-05-30.002800.100000.03697
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23030
FillerSilica -amorphous-7631-86-90.012350.290000.16290
Silica fused60676-86-03.6699986.1500048.39122
HardenerPhenolic resinProprietary0.182754.290002.40973
PigmentCarbon black1333-86-40.008090.190000.10672
PolymerEpoxy resin systemProprietary0.369348.670004.87002
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00124
Tin solderTin (Sn)7440-31-50.1699099.940002.24022
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0100099.990000.13184
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.