Chemical content BC69-25PA

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Type numberPackagePackage descriptionTotal product weight
BC69-25PASOT1061HUSON37.59463 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065813115512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01448
FillerSilver (Ag)7440-22-40.0924084.000001.21665
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14484
Isobornyl Methacrylate7534-94-30.005505.000000.07242
DieDoped siliconSilicon (Si)7440-21-30.23000100.000003.02846
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000034.77942
Magnesium (Mg)7439-95-40.008410.300000.11076
Nickel (Ni)7440-02-00.098143.500001.29223
Silicon (Si)7440-21-30.024390.870000.32121
Pure metal layerGold (Au)7440-57-50.001120.040000.01477
Nickel (Ni)7440-02-00.028041.000000.36921
Palladium (Pd)7440-05-30.002520.090000.03323
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22998
FillerSilica -amorphous-7631-86-90.012350.290000.16267
Silica fused60676-86-03.6699986.1500048.32349
HardenerPhenolic resinProprietary0.182754.290002.40636
PigmentCarbon black1333-86-40.008090.190000.10658
PolymerEpoxy resin systemProprietary0.369348.670004.86320
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00124
Tin solderTin (Sn)7440-31-50.1699099.940002.23708
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0206399.990000.27159
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.