Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC807-25QC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC807-25QC-QSOT8009DFN1412D-32.461921 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662748147312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01064076.0000000.432183
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00146610.4700000.059539
Phenolic resinProprietary0.00189413.5300000.076940
subTotal0.014000100.0000000.568662
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000003.249495
subTotal0.080000100.0000003.249495
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.254103
Magnesium (Mg)7439-95-40.0016980.1454000.068982
Nickel (Ni)7440-02-00.0339762.9089001.380059
Silicon (Si)7440-21-30.0073620.6303000.299031
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017696
Nickel (Ni)7440-02-00.0335472.8722001.362647
Palladium (Pd)7440-05-30.0014800.1267000.060110
subTotal1.168000100.00000047.442627
Mould CompoundFillerSilica -amorphous-7631-86-90.0887387.9800003.604405
Silica fused60676-86-00.89062380.09200036.175939
PigmentCarbon black1333-86-40.0103190.9280000.419159
PolymerEpoxy resin systemProprietary0.0939648.4500003.816694
Phenolic resinProprietary0.0283562.5500001.151784
subTotal1.112000100.00000045.167981
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000152
Non hazardousProprietary0.0000460.0555000.001871
Tin solderTin (Sn)7440-31-50.08295099.9400003.369328
subTotal0.083000100.0000003.371351
WireImpurityNon hazardousProprietary0.0000000.0100000.000020
Pure metalCopper (Cu)7440-50-80.00492199.9900000.199865
subTotal0.004921100.0000000.199885
total2.461921100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.