Chemical content BC807-25QC-Q

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Type numberPackagePackage descriptionTotal product weight
BC807-25QC-QSOT8009DFN1412D-32.46192 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346627481473126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43218
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.05954
Phenolic resinProprietary0.0018913.530000.07694
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.24950
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.25412
Magnesium (Mg)7439-95-40.001700.145400.06898
Nickel (Ni)7440-02-00.033982.908901.38006
Silicon (Si)7440-21-30.007360.630300.29903
Pure metal layerGold (Au)7440-57-50.000440.037300.01770
Nickel (Ni)7440-02-00.033552.872201.36265
Palladium (Pd)7440-05-30.001480.126700.06011
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.60441
Silica fused60676-86-00.8906280.0920036.17595
PigmentCarbon black1333-86-40.010320.928000.41916
PolymerEpoxy resin systemProprietary0.093968.450003.81670
Phenolic resinProprietary0.028362.550001.15178
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00187
Tin solderTin (Sn)7440-31-50.0829599.940003.36933
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0049299.990000.19986
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.