Chemical content BC807-25QCH-Q

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Type numberPackagePackage descriptionTotal product weight
BC807-25QCH-QSOT8009DFN1412D-32.46233 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664303147212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43211
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.05953
Phenolic resinProprietary0.0018913.530000.07693
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.24896
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.24675
Magnesium (Mg)7439-95-40.001700.145400.06897
Nickel (Ni)7440-02-00.033982.908901.37983
Silicon (Si)7440-21-30.007360.630300.29898
Pure metal layerGold (Au)7440-57-50.000440.037300.01769
Nickel (Ni)7440-02-00.033552.872201.36242
Palladium (Pd)7440-05-30.001480.126700.06010
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.60381
Silica fused60676-86-00.8906280.0920036.16993
PigmentCarbon black1333-86-40.010320.928000.41909
PolymerEpoxy resin systemProprietary0.093968.450003.81606
Phenolic resinProprietary0.028362.550001.15159
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00187
Tin solderTin (Sn)7440-31-50.0829599.940003.36877
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0053399.990000.21636
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.