Chemical content BC807-40QA

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Type numberPackagePackage descriptionTotal product weight
BC807-40QASOT1215DFN1010D-31.19084 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340671571474126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02519
FillerSilver (Ag)7440-22-40.0252084.000002.11615
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.25192
Isobornyl Methacrylate7534-94-30.001505.000000.12596
DieDoped siliconSilicon (Si)7440-21-30.08000100.000006.71795
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10682
Copper (Cu)7440-50-80.5009094.5100042.06300
Tin (Sn)7440-31-50.001270.240000.10682
Zinc (Zn)7440-66-60.001110.210000.09346
Pure metal layerGold (Au)7440-57-50.000370.070000.03115
Nickel (Ni)7440-02-00.022954.330001.92713
Palladium (Pd)7440-05-30.002120.400000.17803
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.85019
Silica fused60676-86-00.3060060.0000025.69615
Flame retardantMetal hydroxideProprietary0.015303.000001.28481
ImpurityBismuth (Bi)7440-69-90.002550.500000.21413
PigmentCarbon black1333-86-40.002550.500000.21413
PolymerEpoxy resin systemProprietary0.035707.000002.99788
Phenolic resinProprietary0.030606.000002.56961
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00140
Tin solderTin (Sn)7440-31-50.0299899.940002.51772
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0108499.990000.91019
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.