Chemical content BC807W

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Type numberPackagePackage descriptionTotal product weight
BC807WSOT323SC-705.59574 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93402717013513126030 s123520 s3Seremban, Malaysia; Dongguan, China; Suqian, China; D-22529 HAMBURG, Germany 
93402717011513126030 s123520 s3Suqian, China; Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.11000100.000001.96578
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.02975
Carbon (C)7440-44-00.000740.040000.01322
Chromium (Cr)7440-47-30.001660.090000.02975
Cobalt (Co)7440-48-40.007960.430000.14216
Iron (Fe)7439-89-60.8260244.6500014.76168
Manganese (Mn)7439-96-50.012760.690000.22812
Nickel (Ni)7440-02-00.6389934.5400011.41922
Phosphorus (P)7723-14-00.000370.020000.00661
Silicon (Si)7440-21-30.004810.260000.08596
Sulphur (S)7704-34-90.000370.020000.00661
Pure metal layerCopper (Cu)7440-50-80.3117216.850005.57076
Silver (Ag)7440-22-40.042922.320000.76701
Mould CompoundFillerSilica fused60676-86-02.5534075.1000045.63114
PigmentCarbon black1333-86-40.010200.300000.18228
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.63309
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.31400
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00021
Tin solderTin (Sn)7440-31-50.2299899.990004.10986
WirePure metalCopper (Cu)7440-50-80.00574100.000000.10252
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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