Chemical content BC817-16QB

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Type numberPackagePackage descriptionTotal product weight
BC817-16QBSOT8015DFN1110D-31.62470 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346609651473126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28067
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03867
Phenolic resinProprietary0.0008113.530000.04997
DieDoped siliconSilicon (Si)7440-21-30.06000100.000003.69299
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.24243
Magnesium (Mg)7439-95-40.001120.149000.06897
Nickel (Ni)7440-02-00.022422.980901.37972
Silicon (Si)7440-21-30.004860.645900.29896
Pure metal layerGold (Au)7440-57-50.000060.007700.00356
Nickel (Ni)7440-02-00.004470.594000.27494
Palladium (Pd)7440-05-30.000270.036500.01689
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.18800
FillerSilica -amorphous-7631-86-90.002160.290000.13298
Silica fused60676-86-00.6418286.1500039.50375
HardenerPhenolic resinProprietary0.031964.290001.96716
PigmentCarbon black1333-86-40.001420.190000.08712
PolymerEpoxy resin systemProprietary0.064598.670003.97560
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00195
Tin solderTin (Sn)7440-31-50.0569799.940003.50623
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0047099.990000.28919
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.