Chemical content BC817K-16H

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Type numberPackagePackage descriptionTotal product weight
BC817K-16HSOT23TO-236AB8.85681 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346602232352126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
9346602232152126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34776
PolymerResin systemProprietary0.0092023.000000.10387
DieDoped siliconSilicon (Si)7440-21-30.09000100.000001.01617
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.96605
Iron (Fe)7439-89-60.082912.520000.93609
Lead (Pb)7439-92-10.000990.030000.01114
Phosphorus (P)7723-14-00.004940.150000.05572
Zinc (Zn)7440-66-60.006250.190000.07058
Pure metal layerSilver (Ag)7440-22-40.098042.980001.10697
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23470
FillerSilica -amorphous-7631-86-90.014700.290000.16601
Silica fused60676-86-04.3678086.1500049.31578
HardenerPhenolic resinProprietary0.217504.290002.45577
PigmentCarbon black1333-86-40.009630.190000.10876
PolymerEpoxy resin systemProprietary0.439578.670004.96306
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00219
Tin solderTin (Sn)7440-31-50.3497999.940003.94939
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0168199.990000.18976
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.