Chemical content BC847AQB-Q

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Type numberPackagePackage descriptionTotal product weight
BC847AQB-QSOT8015DFN1110D-31.59462 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662970147112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28596
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03939
Phenolic resinProprietary0.0008113.530000.05091
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.88133
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860045.07699
Magnesium (Mg)7439-95-40.001120.149000.07027
Nickel (Ni)7440-02-00.022422.980901.40575
Silicon (Si)7440-21-30.004860.645900.30460
Pure metal layerGold (Au)7440-57-50.000060.007700.00363
Nickel (Ni)7440-02-00.004470.594000.28012
Palladium (Pd)7440-05-30.000270.036500.01721
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.19155
FillerSilica -amorphous-7631-86-90.002160.290000.13549
Silica fused60676-86-00.6418286.1500040.24893
HardenerPhenolic resinProprietary0.031964.290002.00427
PigmentCarbon black1333-86-40.001420.190000.08877
PolymerEpoxy resin systemProprietary0.064598.670004.05059
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00198
Tin solderTin (Sn)7440-31-50.0569799.940003.57237
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0046299.990000.29001
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.