Chemical content BC847BQB-Q

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Type numberPackagePackage descriptionTotal product weight
BC847BQB-QSOT8015DFN1110D-31.59418 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346629711471126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28604
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03941
Phenolic resinProprietary0.0008113.530000.05092
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.88185
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860045.08943
Magnesium (Mg)7439-95-40.001120.149000.07029
Nickel (Ni)7440-02-00.022422.980901.40614
Silicon (Si)7440-21-30.004860.645900.30468
Pure metal layerGold (Au)7440-57-50.000060.007700.00363
Nickel (Ni)7440-02-00.004470.594000.28020
Palladium (Pd)7440-05-30.000270.036500.01722
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.19160
FillerSilica -amorphous-7631-86-90.002160.290000.13552
Silica fused60676-86-00.6418286.1500040.26004
HardenerPhenolic resinProprietary0.031964.290002.00482
PigmentCarbon black1333-86-40.001420.190000.08879
PolymerEpoxy resin systemProprietary0.064598.670004.05171
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00198
Tin solderTin (Sn)7440-31-50.0569799.940003.57336
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0041899.990000.26224
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.