Chemical content BC847RAPN

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Type numberPackagePackage descriptionTotal product weight
BC847RAPNSOT1268-1DFN1412-62.35600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934070162147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1064076.000004.51613
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0146610.470000.62216
Phenolic resinProprietary0.0189413.530000.80399
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.27334
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.27334
Lead FrameCopper alloyCopper (Cu)7440-50-80.9185195.6780038.98594
Magnesium (Mg)7439-95-40.001430.149200.06079
Nickel (Ni)7440-02-00.028642.983701.21577
Silicon (Si)7440-21-30.006210.646500.26343
Pure metal layerGold (Au)7440-57-50.000110.011400.00465
Nickel (Ni)7440-02-00.004760.495500.20190
Palladium (Pd)7440-05-30.000340.035700.01455
Mould CompoundFillerSilica -amorphous-7631-86-90.2599023.0000011.03141
Silica fused60676-86-00.6780060.0000028.77759
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.033903.000001.43888
Ion trapping agentBismuth (Bi)7440-69-90.005650.500000.23981
PigmentCarbon black1333-86-40.005650.500000.23981
PolymerEpoxy resin systemProprietary0.079107.000003.35739
Phenolic resinProprietary0.067806.000002.87776
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000030.055500.00118
Tin solderTin (Sn)7440-31-50.0499799.940002.12097
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0160099.990000.67905
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.