Chemical content BC856BQB

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Type numberPackagePackage descriptionTotal product weight
BC856BQBSOT8015DFN1110D-31.60218 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346626631472126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.33205
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04574
Phenolic resinProprietary0.0009513.530000.05911
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.87245
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.86429
Magnesium (Mg)7439-95-40.001120.149000.06993
Nickel (Ni)7440-02-00.022422.980901.39912
Silicon (Si)7440-21-30.004860.645900.30316
Pure metal layerGold (Au)7440-57-50.000060.007700.00361
Nickel (Ni)7440-02-00.004470.594000.27880
Palladium (Pd)7440-05-30.000270.036500.01713
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.74550
Silica fused60676-86-00.6022980.0920037.59202
PigmentCarbon black1333-86-40.006980.928000.43557
PolymerEpoxy resin systemProprietary0.063548.450003.96610
Phenolic resinProprietary0.019182.550001.19687
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00197
Tin solderTin (Sn)7440-31-50.0569799.940003.55552
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0041899.990000.26093
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.