Chemical content BC857BM

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Type numberPackagePackage descriptionTotal product weight
BC857BMdummy POV SOT883XQFN30.85543 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405714731514126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.88844
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12239
Phenolic resinProprietary0.0013513.530000.15817
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.50701
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.95451
Magnesium (Mg)7439-95-40.000630.146000.07339
Nickel (Ni)7440-02-00.012532.913001.46428
Silicon (Si)7440-21-30.002710.631000.31719
MetallisationGold (Au)7440-57-50.000150.035000.01759
Nickel (Ni)7440-02-00.011852.755001.38486
Palladium (Pd)7440-05-30.000470.110000.05529
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.94821
Silica fused60676-86-00.2220060.0000025.95186
Flame retardantMetal hydroxideProprietary0.011103.000001.29759
ImpurityBismuth (Bi)7440-69-90.001850.500000.21627
PigmentCarbon black1333-86-40.001850.500000.21627
PolymerEpoxy resin systemProprietary0.025907.000003.02772
Phenolic resinProprietary0.022206.000002.59519
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00065
Tin solderTin (Sn)7440-31-50.0099999.940001.16830
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0054399.990000.63459
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.