Chemical content BC857BQA

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Type numberPackagePackage descriptionTotal product weight
BC857BQASOT1215DFN1010D-31.13726 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340690711472126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02638
FillerSilver (Ag)7440-22-40.0252084.000002.21585
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.26379
Isobornyl Methacrylate7534-94-30.001505.000000.13190
DieDoped siliconSilicon (Si)7440-21-30.03000100.000002.63792
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.11185
Copper (Cu)7440-50-80.5009094.5100044.04472
Tin (Sn)7440-31-50.001270.240000.11185
Zinc (Zn)7440-66-60.001110.210000.09787
Pure metal layerGold (Au)7440-57-50.000370.070000.03262
Nickel (Ni)7440-02-00.022954.330002.01792
Palladium (Pd)7440-05-30.002120.400000.18641
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.0000010.31426
Silica fused60676-86-00.3060060.0000026.90678
Flame retardantMetal hydroxideProprietary0.015303.000001.34534
ImpurityBismuth (Bi)7440-69-90.002550.500000.22422
PigmentCarbon black1333-86-40.002550.500000.22422
PolymerEpoxy resin systemProprietary0.035707.000003.13912
Phenolic resinProprietary0.030606.000002.69068
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00012
Non hazardousProprietary0.000020.055500.00146
Tin solderTin (Sn)7440-31-50.0299899.940002.63634
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0072699.990000.63822
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.