Chemical content BC857CMB

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Type numberPackagePackage descriptionTotal product weight
BC857CMBSOT883BXQFN30.68008 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340658913155126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33525
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04619
Phenolic resinProprietary0.0004113.530000.05968
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41125
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09881
Copper (Cu)7440-50-80.2632094.0000038.70133
Tin (Sn)7440-31-50.000670.240000.09881
Zinc (Zn)7440-66-60.000590.210000.08646
Pure metal layerGold (Au)7440-57-50.000220.080000.03294
Nickel (Ni)7440-02-00.013834.940002.03388
Palladium (Pd)7440-05-30.000810.290000.11940
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.49865
Silica fused60676-86-00.2040060.0000029.99647
Flame retardantMetal hydroxideProprietary0.010203.000001.49982
ImpurityBismuth (Bi)7440-69-90.001700.500000.24997
PigmentCarbon black1333-86-40.001700.500000.24997
PolymerEpoxy resin systemProprietary0.023807.000003.49959
Phenolic resinProprietary0.020406.000002.99965
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93907
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0070899.990001.04036
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.