Chemical content BC868-25-Q

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Type numberPackagePackage descriptionTotal product weight
BC868-25-QSOT89MPT340.51968 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346647801151126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0847077.000000.20903
PolymerResin systemProprietary0.0253023.000000.06244
DieDoped siliconSilicon (Si)7440-21-30.33000100.000000.81442
Lead FrameCopper alloyCopper (Cu)7440-50-817.1291199.8200042.27356
Iron (Fe)7439-89-60.017160.100000.04235
Phosphorus (P)7723-14-00.005150.030000.01270
Pure metal layerSilver (Ag)7440-22-40.008580.050000.02117
Mould CompoundAdditiveNon hazardousProprietary0.661492.900001.63252
FillerSilica -amorphous-7631-86-916.4232072.0000040.53142
PigmentCarbon black1333-86-40.011400.050000.02815
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.4215015.000008.44404
Phenol Formaldehyde resin (generic)9003-35-42.2810010.000005.62936
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00001
Non hazardousProprietary0.000040.055500.00010
Tin solderTin (Sn)7440-31-50.0699699.940000.17265
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0396799.990000.09791
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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