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Chemical content BCM62B

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Type numberPackagePackage descriptionTotal product weight
BCM62BSOT143BSOT48.91810 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340598822151312601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia; Melaka, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000000.89705
subTotal0.08000100.000000.89705
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002700.080000.03023
Carbon (C)7440-44-00.001350.040000.01512
Chromium (Cr)7440-47-30.007080.210000.07936
Cobalt (Co)7440-48-40.014150.420000.15871
Iron (Fe)7439-89-61.5933447.2800017.86632
Manganese (Mn)7439-96-50.028640.850000.32120
Nickel (Ni)7440-02-01.2003935.6200013.46020
Phosphorus (P)7723-14-00.000670.020000.00756
Silicon (Si)7440-21-30.008760.260000.09825
Sulphur (S)7704-34-90.000670.020000.00756
Pure metal layerCopper (Cu)7440-50-80.4408013.080004.94271
Silver (Ag)7440-22-40.071442.120000.80111
subTotal3.37000100.0000037.78833
Mould CompoundFillerSilica fused60676-86-03.5287071.0000039.56785
PigmentCarbon black1333-86-40.014910.300000.16719
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9790919.7000010.97868
Phenolic resinProprietary0.447309.000005.01564
subTotal4.97000100.0000055.72936
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00024
Non hazardousProprietary0.000260.055500.00292
Tin solderTin (Sn)7440-31-50.4697299.940005.26702
subTotal0.47000100.000005.27018
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0281099.990000.31511
subTotal0.02810100.000000.31514
total8.91810100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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