Chemical content BCP68-25

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Type numberPackagePackage descriptionTotal product weight
BCP68-25SOT223SC-73105.76048 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93396937013514126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
93396937011514126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.33000100.000000.31203
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500047.96228
Iron (Fe)7439-89-60.051160.100000.04837
Phosphorus (P)7723-14-00.015350.030000.01451
Pure metal layerSilver (Ag)7440-22-40.368350.720000.34829
Mould CompoundFillerSilica fused60676-86-039.9682275.1000037.79126
PigmentCarbon black1333-86-40.159660.300000.15096
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.3135017.500008.80622
Phenol Formaldehyde resin (generic)9003-35-43.778627.100003.57281
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00054
Tin solderTin (Sn)7440-31-51.0193999.940000.96386
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalCopper (Cu)7440-50-80.0304899.990000.02882
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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