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Chemical content BSP19

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Type numberPackagePackage descriptionTotal product weight
BSP19SOT223SC-73105.56758 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9339834001151412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.15000100.000000.14209
subTotal0.15000100.000000.14209
Lead FrameCopper alloyCopper (Cu)7440-50-850.8888599.4700048.20500
Iron (Fe)7439-89-60.051160.100000.04846
Phosphorus (P)7723-14-00.015350.030000.01454
Pure metal layerSilver (Ag)7440-22-40.204640.400000.19385
subTotal51.16000100.0000048.46185
Mould CompoundFillerSilica fused60676-86-039.9682275.1000037.86032
PigmentCarbon black1333-86-40.159660.300000.15124
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.3135017.500008.82231
Phenol Formaldehyde resin (generic)9003-35-43.778627.100003.57934
subTotal53.22000100.0000050.41321
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00054
Tin solderTin (Sn)7440-31-51.0193999.940000.96563
subTotal1.02000100.000000.96621
WirePure metalCopper (Cu)7440-50-80.01758100.000000.01665
subTotal0.01758100.000000.01665
total105.56758100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.