Chemical content BSP225

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Type number	Package	Package description	Total product weight
BSP225	dummy POV SOT223	SC-73	103.13800 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934000510115	13	1	260		1	235			Dongguan, China; Manchester, United Kingdom

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.10010	77.00000	0.09705
	Polymer	Resin system	Proprietary	0.02990	23.00000	0.02899
		subTotal		0.13000	100.00000	0.12604

Die	Doped silicon	Silicon (Si)	7440-21-3	0.80525	100.00000	0.78075
		subTotal		0.80525	100.00000	0.78075

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	50.72514	99.15000	49.18181
		Iron (Fe)	7439-89-6	0.05116	0.10000	0.04960
		Phosphorus (P)	7723-14-0	0.01535	0.03000	0.01488
	Pure metal layer	Silver (Ag)	7440-22-4	0.36835	0.72000	0.35714
		subTotal		51.16000	100.00000	49.60343

Mould Compound	Filler	Silica fused	60676-86-0	34.64090	71.00000	33.58694
	Pigment	Carbon black	1333-86-4	0.14637	0.30000	0.14192
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	9.61163	19.70000	9.31919
		Phenolic resin	Proprietary	4.39110	9.00000	4.25750
		subTotal		48.79000	100.00000	47.30555

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00010	0.00450	0.00010
		Non hazardous	Proprietary	0.00123	0.05550	0.00119
	Tin solder	Tin (Sn)	7440-31-5	2.20867	99.94000	2.14147
		subTotal		2.21000	100.00000	2.14276

Wire	Pure metal	Gold (Au)	7440-57-5	0.04275	100.00000	0.04145
		subTotal		0.04275	100.00000	0.04145

		total		103.13800	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.