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Chemical content BSS192

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Type numberPackagePackage descriptionTotal product weight
BSS192SOT89MPT341.20731 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9339439501351412601235Dongguan, China; Manchester, United Kingdom 
9339439501151512601235Manchester, United Kingdom; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0847077.000000.20555
PolymerResin systemProprietary0.0253023.000000.06140
subTotal0.11000100.000000.26695
DieDoped siliconSilicon (Si)7440-21-30.80525100.000001.95414
subTotal0.80525100.000001.95414
Lead FrameCopper alloyCopper (Cu)7440-50-817.2458099.0000041.85131
Iron (Fe)7439-89-60.017420.100000.04227
Phosphorus (P)7723-14-00.005230.030000.01268
Pure metal layerSilver (Ag)7440-22-40.151550.870000.36778
subTotal17.42000100.0000042.27404
Mould CompoundAdditiveNon hazardousProprietary0.660332.900001.60246
Triphenylphosphine603-35-00.011380.050000.02763
FillerSilica -amorphous-7631-86-916.3944072.0000039.78517
PigmentCarbon black1333-86-40.011380.050000.02763
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.4155015.000008.28858
Phenol Formaldehyde resin (generic)9003-35-42.2770010.000005.52572
subTotal22.77000100.0000055.25719
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00001
Non hazardousProprietary0.000040.055500.00009
Tin solderTin (Sn)7440-31-50.0699699.940000.16977
subTotal0.07000100.000000.16987
WirePure metalGold (Au)7440-57-50.03206100.000000.07780
subTotal0.03206100.000000.07780
total41.20731100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.