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Chemical content BSS84AKV

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
BSS84AKVSOT666SOT62.78615 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340653061155126030 s123520 s3Kyoto, Japan; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.002032.540000.07293
Doped siliconSilicon (Si)7440-21-30.0728291.030002.61379
Gold alloyGold (Au)7440-57-50.005146.430000.18463
subTotal0.08000100.000002.87135
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.000930.080000.03331
Carbon (C)7440-44-00.000460.040000.01665
Chromium (Cr)7440-47-30.002440.210000.08743
Cobalt (Co)7440-48-40.004870.420000.17486
Iron (Fe)7439-89-60.5417246.7000019.44332
Manganese (Mn)7439-96-50.009740.840000.34973
Nickel (Ni)7440-02-00.4080935.1800014.64702
Phosphorus (P)7723-14-00.000230.020000.00833
Silicon (Si)7440-21-30.002900.250000.10409
Sulphur (S)7704-34-90.000230.020000.00833
Pure metal layerCopper (Cu)7440-50-80.1497612.910005.37502
Silver (Ag)7440-22-40.038633.330001.38643
subTotal1.16000100.0000041.63452
Mould CompoundFillerSilica fused60676-86-01.0426271.0000037.42156
PigmentCarbon black1333-86-40.004410.300000.15812
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.2892919.7000010.38317
Phenolic resinProprietary0.132169.000004.74358
subTotal1.46848100.0000052.70643
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00011
Tin solderTin (Sn)7440-31-50.0636999.990002.28608
subTotal0.06370100.000002.28630
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0139799.990000.50132
subTotal0.01397100.000000.50137
total2.78615100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.