Chemical content BUK6D125-60E

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Type numberPackagePackage descriptionTotal product weight
BUK6D125-60ESOT1220SOT12207.10764 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660746115212601235Manchester, United Kingdom; Dongguan, China; Sherman, United States Of America; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00985
FillerSilver (Ag)7440-22-40.0588084.000000.82728
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09849
Isobornyl Methacrylate7534-94-30.003505.000000.04924
DieDoped siliconSilicon (Si)7440-21-30.24000100.000003.37665
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956038.05641
Magnesium (Mg)7439-95-40.004220.145900.05932
Nickel (Ni)7440-02-00.084352.918801.18680
Silicon (Si)7440-21-30.018280.632400.25714
Pure metal layerGold (Au)7440-57-50.000960.033300.01354
Nickel (Ni)7440-02-00.074012.561001.04131
Palladium (Pd)7440-05-30.003270.113000.04595
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000012.07011
Silica fused60676-86-02.2380060.0000031.48724
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.111903.000001.57436
Ion trapping agentBismuth (Bi)7440-69-90.018650.500000.26239
PigmentCarbon black1333-86-40.018650.500000.26239
PolymerEpoxy resin systemProprietary0.261107.000003.67351
Phenolic resinProprietary0.223806.000003.14872
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00133
Tin solderTin (Sn)7440-31-50.1699099.940002.39036
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0076499.990000.10748
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.