×

Chemical content BUK6D23-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6D23-40ESOT1220SOT12207.49087 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660304125112601235Hsin-chu, Taiwan; Sherman, United States Of America; Manchester, United Kingdom; Dongguan, China 
934660304115212601235Manchester, United Kingdom; Sherman, United States Of America; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00934
FillerSilver (Ag)7440-22-40.0588084.000000.78496
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09345
Isobornyl Methacrylate7534-94-30.003505.000000.04672
subTotal0.07000100.000000.93447
DieDoped siliconSilicon (Si)7440-21-30.57000100.000007.60926
subTotal0.57000100.000007.60926
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.10946
Magnesium (Mg)7439-95-40.004220.145900.05629
Nickel (Ni)7440-02-00.084352.918801.12608
Silicon (Si)7440-21-30.018280.632400.24398
Pure metal layerGold (Au)7440-57-50.000960.033300.01285
Nickel (Ni)7440-02-00.074012.561000.98804
Palladium (Pd)7440-05-30.003270.113000.04360
subTotal2.89000100.0000038.58030
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.45261
Silica fused60676-86-02.2380060.0000029.87637
Flame retardantMetal hydroxideProprietary0.111903.000001.49382
ImpurityBismuth (Bi)7440-69-90.018650.500000.24897
PigmentCarbon black1333-86-40.018650.500000.24897
PolymerEpoxy resin systemProprietary0.261107.000003.48558
Phenolic resinProprietary0.223806.000002.98764
subTotal3.73000100.0000049.79396
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.26807
subTotal0.17000100.000002.26943
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalCopper (Cu)7440-50-80.0608799.990000.81254
subTotal0.06087100.000000.81262
total7.49087100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.