Chemical content BUK6Y61-60P

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Type numberPackagePackage descriptionTotal product weight
BUK6Y61-60PSOT669LFPAK77.06200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661185115612601235Cabuyao, Philippines; Seremban, Malaysia; Kuching Sarawak, Malaysia; Kwai Chung, Hong KongLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.91200100.000001.18346
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.47531
Iron (Fe)7439-89-60.007500.150000.00973
Phosphorus (P)7723-14-00.002500.050000.00324
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100049.10069
Iron (Fe)7439-89-60.056860.150000.07379
Phosphorus (P)7723-14-00.015160.040000.01968
Mould CompoundAdditiveNon hazardousProprietary0.312061.400000.40495
FillerSilica -amorphous-7631-86-91.404276.300001.82226
Silica fused60676-86-016.0488072.0000020.82583
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.445802.000000.57850
PigmentCarbon black1333-86-40.066870.300000.08677
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.490382.200000.63634
Non hazardousProprietary0.980764.400001.27269
Phenol Formaldehyde resin (generic)9003-35-41.203665.400001.56194
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00050
Tin alloyTin (Sn)7440-31-53.8496299.990004.99548
Solder PasteLead alloyLead (Pb)7439-92-16.5675092.500008.52236
Silver (Ag)7440-22-40.177502.500000.23033
Tin (Sn)7440-31-50.355005.000000.46067
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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