Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7S1R0-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7S1R0-40HSOT1235LFPAK88346.07000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346605611184126030 s126020 s3Newport, United Kingdom; Seremban, Malaysia; Manchester, United Kingdom; Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.90000100.000000.54902
subTotal1.90000100.000000.54902
ClipCopper alloyCopper (Cu)7440-50-847.1339299.8600013.61976
Iron (Fe)7439-89-60.051920.110000.01500
Phosphorus (P)7723-14-00.014160.030000.00409
subTotal47.20000100.0000013.63885
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600049.96895
Iron (Fe)7439-89-60.225120.130000.06505
Phosphorus (P)7723-14-00.051950.030000.01501
subTotal173.17000100.0000050.04901
Mould CompoundFillerSilica fused60676-86-063.3330062.0000018.30063
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.57516
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05903
PigmentCarbon black1333-86-40.510750.500000.14759
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.59034
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.24689
Phenolic resinProprietary8.989208.800002.59751
subTotal102.15000100.0000029.51715
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.40998
subTotal4.88000100.000001.41012
Solder PasteImpurityAntimony (Sb)7440-36-00.003550.030000.00102
Lead alloyLead (Pb)7439-92-110.9299592.470003.15831
Silver (Ag)7440-22-40.295502.500000.08539
Tin (Sn)7440-31-50.591005.000000.17077
subTotal11.82000100.000003.41549
Solder PasteImpurityAntimony (Sb)7440-36-00.001980.040000.00057
Lead alloyLead (Pb)7439-92-14.5772692.470001.32264
Silver alloySilver (Ag)7440-22-40.123752.500000.03576
Tin alloyTin (Sn)7440-31-50.247505.000000.07152
subTotal4.95000100.000001.43049
total346.07000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.