Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7Y41-80E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7Y41-80ESOT669LFPAK77.140000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340674241155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.000000100.0000001.296344
subTotal1.000000100.0000001.296344
ClipCopper alloyCopper (Cu)7440-50-84.99000099.8000006.468758
Iron (Fe)7439-89-60.0075000.1500000.009723
Phosphorus (P)7723-14-00.0025000.0500000.003241
subTotal5.000000100.0000006.481722
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000049.051038
Iron (Fe)7439-89-60.0568650.1500000.073717
Phosphorus (P)7723-14-00.0151640.0400000.019658
subTotal37.910000100.00000049.144413
Mould CompoundAdditiveNon hazardousProprietary1.3067405.8000001.693985
FillerSilica -amorphous-7631-86-91.4193906.3000001.840018
Silica fused60676-86-016.22160072.00000021.028779
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.4506002.0000000.584133
PigmentCarbon black1333-86-40.0675900.3000000.087620
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.4956602.2000000.642546
Epoxy resin systemProprietary1.3518006.0000001.752398
Phenol Formaldehyde resin (generic)9003-35-41.2166205.4000001.577158
subTotal22.530000100.00000029.206637
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000499
Tin alloyTin (Sn)7440-31-53.84961599.9900004.990426
subTotal3.850000100.0000004.990926
Solder PasteLead alloyLead (Pb)7439-92-13.72775092.5000004.832447
Silver (Ag)7440-22-40.1007502.5000000.130607
Tin (Sn)7440-31-50.2015005.0000000.261213
subTotal4.030000100.0000005.224268
Solder PasteImpurityAntimony (Sb)7440-36-00.0008460.0300000.001097
Lead alloyLead (Pb)7439-92-12.60765492.4700003.380417
Silver (Ag)7440-22-40.0705002.5000000.091392
Tin (Sn)7440-31-50.1410005.0000000.182785
subTotal2.820000100.0000003.655691
total77.140000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.