×

Chemical content BUK9D23-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9D23-40ESOT1220SOT12207.48087 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660213115212601235Hsin-chu, Taiwan; Dongguan, China; Manchester, United Kingdom; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00936
FillerSilver (Ag)7440-22-40.0588084.000000.78600
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09357
Isobornyl Methacrylate7534-94-30.003505.000000.04679
subTotal0.07000100.000000.93572
DieDoped siliconSilicon (Si)7440-21-30.56000100.000007.48576
subTotal0.56000100.000007.48576
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.15773
Magnesium (Mg)7439-95-40.004220.145900.05636
Nickel (Ni)7440-02-00.084352.918801.12759
Silicon (Si)7440-21-30.018280.632400.24431
Pure metal layerGold (Au)7440-57-50.000960.033300.01286
Nickel (Ni)7440-02-00.074012.561000.98936
Palladium (Pd)7440-05-30.003270.113000.04365
subTotal2.89000100.0000038.63186
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.46792
Silica fused60676-86-02.2380060.0000029.91631
Flame retardantMetal hydroxideProprietary0.111903.000001.49582
ImpurityBismuth (Bi)7440-69-90.018650.500000.24930
PigmentCarbon black1333-86-40.018650.500000.24930
PolymerEpoxy resin systemProprietary0.261107.000003.49024
Phenolic resinProprietary0.223806.000002.99163
subTotal3.73000100.0000049.86052
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.27110
subTotal0.17000100.000002.27246
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalCopper (Cu)7440-50-80.0608799.990000.81363
subTotal0.06087100.000000.81371
total7.48087100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.