Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9K52-60E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9K52-60ESOT1205LFPAK56D78.627200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340669781155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.300000100.0000001.653372
subTotal1.300000100.0000001.653372
ClipCopper alloyCopper (Cu)7440-50-84.99998099.8000006.359097
Iron (Fe)7439-89-60.0075150.1500000.009558
Phosphorus (P)7723-14-00.0025050.0500000.003186
subTotal5.010000100.0000006.371841
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000044.932542
Iron (Fe)7439-89-60.0531000.1500000.067534
Phosphorus (P)7723-14-00.0177000.0500000.022511
subTotal35.400000100.00000045.022588
Mould CompoundAdditiveNon hazardousProprietary1.8908005.8000002.404766
FillerSilica -amorphous-7631-86-92.0538006.3000002.612073
Silica fused60676-86-023.47200072.00000029.852265
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.829230
PigmentCarbon black1333-86-40.0978000.3000000.124384
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.912153
Epoxy resin systemProprietary1.9560006.0000002.487689
Phenol Formaldehyde resin (generic)9003-35-41.7604005.4000002.238920
subTotal32.600000100.00000041.461479
Post-PlatingImpurityNon hazardousProprietary0.0001930.0100000.000245
Tin alloyTin (Sn)7440-31-51.92980799.9900002.454376
subTotal1.930000100.0000002.454621
Solder PasteLead alloyLead (Pb)7439-92-10.62160092.5000000.790566
Silver (Ag)7440-22-40.0168002.5000000.021367
Tin (Sn)7440-31-50.0336005.0000000.042733
subTotal0.672000100.0000000.854666
Solder PasteImpurityAntimony (Sb)7440-36-00.0005150.0300000.000654
Lead alloyLead (Pb)7439-92-11.58604592.4700002.017171
Silver (Ag)7440-22-40.0428802.5000000.054536
Tin (Sn)7440-31-50.0857605.0000000.109072
subTotal1.715200100.0000002.181433
total78.627200100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.