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Chemical content BUK9M24-60E

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Type numberPackagePackage descriptionTotal product weight
BUK9M24-60ESOT1210mLFPAK37.45800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070053115112601260Seremban, Malaysia; Sherman, United States Of America; Dongguan, China; Manchester, United Kingdom; Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.03800100.000002.77110
subTotal1.03800100.000002.77110
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000015.18661
Iron (Fe)7439-89-60.008550.150000.02283
Phosphorus (P)7723-14-00.002850.050000.00761
subTotal5.70000100.0000015.21705
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000037.03401
Iron (Fe)7439-89-60.020850.150000.05566
Phosphorus (P)7723-14-00.006950.050000.01855
subTotal13.90000100.0000037.10822
Mould CompoundFillerSilica fused60676-86-05.2886062.0000014.11875
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.52969
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04554
PigmentCarbon black1333-86-40.042650.500000.11386
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.50494
Phenolic resinProprietary0.750648.800002.00395
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.45544
subTotal8.53000100.0000022.77217
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00103
Tin alloyTin (Sn)7440-31-53.8496299.9900010.27715
subTotal3.85000100.0000010.27818
Solder PasteLead alloyLead (Pb)7439-92-14.1070092.5000010.96428
Silver (Ag)7440-22-40.111002.500000.29633
Tin (Sn)7440-31-50.222005.000000.59266
subTotal4.44000100.0000011.85327
total37.45800100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.