Chemical content BUK9M3R3-40H

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Type numberPackagePackage descriptionTotal product weight
BUK9M3R3-40HSOT1210mLFPAK38.40000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660791115212601260Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.59000100.000001.53646
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000014.81406
Iron (Fe)7439-89-60.008550.150000.02227
Phosphorus (P)7723-14-00.002850.050000.00742
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000036.12552
Iron (Fe)7439-89-60.020850.150000.05430
Phosphorus (P)7723-14-00.006950.050000.01810
Mould CompoundFillerSilica fused60676-86-05.2886062.0000013.77240
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.44310
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04443
PigmentCarbon black1333-86-40.042650.500000.11107
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.44349
Phenolic resinProprietary0.750648.800001.95479
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.44427
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00100
Tin alloyTin (Sn)7440-31-53.8496299.9900010.02504
Solder PasteLead alloyLead (Pb)7439-92-11.6187592.500004.21549
Silver (Ag)7440-22-40.043752.500000.11393
Tin (Sn)7440-31-50.087505.000000.22786
Solder PasteImpurityAntimony (Sb)7440-36-00.001220.030000.00319
Lead alloyLead (Pb)7439-92-13.7727892.470009.82494
Silver (Ag)7440-22-40.102002.500000.26563
Tin (Sn)7440-31-50.204005.000000.53125
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.