Chemical content BUK9M52-40E

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Type numberPackagePackage descriptionTotal product weight
BUK9M52-40ESOT1210mLFPAK35.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934070091115112601260Cabuyao, Philippines; Manchester, United Kingdom; Sherman, United States Of America; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.48000100.000001.35977
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000016.11501
Iron (Fe)7439-89-60.008550.150000.02422
Phosphorus (P)7723-14-00.002850.050000.00807
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000039.29802
Iron (Fe)7439-89-60.020850.150000.05907
Phosphorus (P)7723-14-00.006950.050000.01969
Mould CompoundFillerSilica fused60676-86-05.2886062.0000014.98187
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.74547
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04833
PigmentCarbon black1333-86-40.042650.500000.12082
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.65807
Phenolic resinProprietary0.750648.800002.12646
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.48329
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00109
Tin alloyTin (Sn)7440-31-53.8496299.9900010.90542
Solder PasteLead alloyLead (Pb)7439-92-12.5807592.500007.31091
Silver (Ag)7440-22-40.069752.500000.19759
Tin (Sn)7440-31-50.139505.000000.39518
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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