Chemical content BUK9M5R0-40H

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Type numberPackagePackage descriptionTotal product weight
BUK9M5R0-40HSOT1210mLFPAK50.69000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660793115312601260Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.86802
ClipCopper alloyCopper (Cu)7440-50-818.6626099.8000036.81712
Iron (Fe)7439-89-60.028050.150000.05534
Phosphorus (P)7723-14-00.009350.050000.01845
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000027.36674
Iron (Fe)7439-89-60.020850.150000.04113
Phosphorus (P)7723-14-00.006950.050000.01371
Mould CompoundFillerSilica fused60676-86-05.2886062.0000010.43322
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500002.60831
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.03366
PigmentCarbon black1333-86-40.042650.500000.08414
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000001.85106
Phenolic resinProprietary0.750648.800001.48084
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.33656
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00076
Tin alloyTin (Sn)7440-31-53.8496299.990007.59443
Solder PasteLead alloyLead (Pb)7439-92-11.4707592.500002.90146
Silver (Ag)7440-22-40.039752.500000.07842
Tin (Sn)7440-31-50.079505.000000.15684
Solder PasteImpurityAntimony (Sb)7440-36-00.001100.030000.00218
Lead alloyLead (Pb)7439-92-13.4029092.470006.71315
Silver (Ag)7440-22-40.092002.500000.18150
Tin (Sn)7440-31-50.184005.000000.36299
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.