Chemical content BUK9Y19-75B

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Type numberPackagePackage descriptionTotal product weight
BUK9Y19-75BSOT669LFPAK90.63000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934063305115512601260D-22529 HAMBURG, Germany; Cabuyao, Philippines; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.70000100.000004.08253
ClipCopper alloyChromium (Cr)7440-47-30.040800.300000.04502
Copper (Cu)7440-50-813.5428899.5800014.94304
Titanium (Ti)7440-32-60.013600.100000.01501
ImpuritySilicon (Si)7440-21-30.002720.020000.00300
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100041.74994
Iron (Fe)7439-89-60.056860.150000.06274
Phosphorus (P)7723-14-00.015160.040000.01673
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.34803
FillerSilica -amorphous-7631-86-91.419396.300001.56614
Silica fused60676-86-016.2216072.0000017.89871
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.49719
PigmentCarbon black1333-86-40.067590.300000.07458
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.54690
Non hazardousProprietary0.991324.400001.09381
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.34240
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00042
Tin alloyTin (Sn)7440-31-53.8496299.990004.24762
Solder PasteLead alloyLead (Pb)7439-92-18.3620092.500009.22653
Silver (Ag)7440-22-40.226002.500000.24937
Tin (Sn)7440-31-50.452005.000000.49873
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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