Chemical content BZB100A

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Type number	Package	Package description	Total product weight
BZB100A	SOD323	SOD2	4.49162 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934061131115	12	1	260		1	235			Dongguan, China; D-22529 HAMBURG, Germany

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.14000	100.00000	3.11692
		subTotal		0.14000	100.00000	3.11692

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	1.29917	94.83000	28.92433
		Iron (Fe)	7439-89-6	0.03480	2.54000	0.77473
		Lead (Pb)	7439-92-1	0.00041	0.03000	0.00915
		Phosphorus (P)	7723-14-0	0.00206	0.15000	0.04575
		Zinc (Zn)	7440-66-6	0.00274	0.20000	0.06100
	Pure metal layer	Silver (Ag)	7440-22-4	0.03082	2.25000	0.68628
		subTotal		1.37000	100.00000	30.50124

Mould Compound	Filler	Silica fused	60676-86-0	2.00220	71.00000	44.57634
	Pigment	Carbon black	1333-86-4	0.00846	0.30000	0.18835
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	0.55554	19.70000	12.36837
		Phenolic resin	Proprietary	0.25380	9.00000	5.65052
		subTotal		2.82000	100.00000	62.78358

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00001	0.00450	0.00013
		Non hazardous	Proprietary	0.00007	0.05550	0.00161
	Tin solder	Tin (Sn)	7440-31-5	0.12992	99.94000	2.89254
		subTotal		0.13000	100.00000	2.89428

Wire	Pure metal	Gold (Au)	7440-57-5	0.03162	100.00000	0.70398
		subTotal		0.03162	100.00000	0.70398

		total		4.49162	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.