Chemical content BZB784-C5V1

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Type numberPackagePackage descriptionTotal product weight
BZB784-C5V1SOT323SC-705.49373 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340563041151312601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.45621
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02949
Carbon (C)7440-44-00.000720.040000.01311
Chromium (Cr)7440-47-30.003780.210000.06881
Cobalt (Co)7440-48-40.007560.420000.13761
Iron (Fe)7439-89-60.8490647.1700015.45507
Manganese (Mn)7439-96-50.015300.850000.27850
Nickel (Ni)7440-02-00.6397235.5400011.64455
Phosphorus (P)7723-14-00.000360.020000.00655
Silicon (Si)7440-21-30.004500.250000.08191
Sulphur (S)7704-34-90.000360.020000.00655
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.27578
Silver (Ag)7440-22-40.042122.340000.76669
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.47844
PigmentCarbon black1333-86-40.010200.300000.18567
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.83053
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.39410
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.82216
WirePure metalCopper (Cu)7440-50-80.00372100.000000.06780
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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