×

Chemical content BZB84-B75

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZB84-B75SOT23TO-236AB7.84403 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340633632151112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000001.78480
subTotal
Lead FrameIron-nickel alloyChromium (Cr)7440-47-30.006170.210000.07871
Cobalt (Co)7440-48-40.012350.420000.15742
Carbon (C)7440-44-00.001180.040000.01499
Sulphur (S)7704-34-90.000590.020000.00750
Nickel (Ni)7440-02-01.0410535.4100013.27193
Aluminium (Al)7429-90-50.002350.080000.02998
Silicon (Si)7440-21-30.007350.250000.09370
Phosphorus (P)7723-14-00.000590.020000.00750
Manganese (Mn)7439-96-50.024700.840000.31484
Iron (Fe)7439-89-61.3818047.0000017.61594
Pure metal layerSilver (Ag)7440-22-40.079672.710001.01573
Copper (Cu)7440-50-80.3822013.000004.87250
subTotal
Mould CompoundAdditiveNon hazardousProprietary0.132472.900001.68883
Triphenylphosphine603-35-00.002280.050000.02912
FillerSilica -amorphous-7631-86-93.2889672.0000041.92947
PigmentCarbon black1333-86-40.002280.050000.02912
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6852015.000008.73531
Phenol Formaldehyde resin (generic)9003-35-40.4568010.000005.82354
subTotal
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00134
Tin solderTin (Sn)7440-31-50.1898999.940002.42077
subTotal
WirePure metalCopper (Cu)7440-50-80.00603100.000000.07693
subTotal
total7.84403100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.