Chemical content BZB984-C3V6

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Type numberPackagePackage descriptionTotal product weight
BZB984-C3V6SOT663SOT32.52488 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340572351151212601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000003.96058
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.000760.080000.03010
Carbon (C)7440-44-00.000380.040000.01505
Chromium (Cr)7440-47-30.002000.210000.07901
Cobalt (Co)7440-48-40.003990.420000.15803
Iron (Fe)7439-89-60.4438446.7200017.57866
Manganese (Mn)7439-96-50.007980.840000.31605
Nickel (Ni)7440-02-00.3344035.2000013.24419
Phosphorus (P)7723-14-00.000190.020000.00753
Silicon (Si)7440-21-30.002380.250000.09406
Sulphur (S)7704-34-90.000190.020000.00753
Pure metal layerCopper (Cu)7440-50-80.1227412.920004.86122
Silver (Ag)7440-22-40.031163.280001.23412
Mould CompoundFillerSilica fused60676-86-01.0082071.0000039.93061
PigmentCarbon black1333-86-40.004260.300000.16872
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.2797419.7000011.07934
Phenolic resinProprietary0.127809.000005.06163
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00009
Tin solderTin (Sn)7440-31-50.0440099.990001.74248
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0108899.990000.43087
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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