Chemical content BZT52-C18-Q

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Type numberPackagePackage descriptionTotal product weight
BZT52-C18-QSOD123SOD212.07217 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665787115112601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04800100.000000.39761
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.26713
Iron (Fe)7439-89-60.077792.080000.64439
Phosphorus (P)7723-14-00.001500.040000.01239
Zinc (Zn)7440-66-60.004860.130000.04027
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51737
Silver (Ag)7440-22-40.060211.610000.49878
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.93859
FillerSilica -amorphous-7631-86-95.8104072.0000048.13053
PigmentCarbon black1333-86-40.004040.050000.03342
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.02719
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.68480
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.73849
WirePure metalCopper (Cu)7440-50-80.00417100.000000.03456
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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