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Chemical content BZT52-C24

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Type numberPackagePackage descriptionTotal product weight
BZT52-C24SOD123SOD212.07417 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071135115112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
934071135118112601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.41411
subTotal0.05000100.000000.41411
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.26228
Iron (Fe)7439-89-60.077792.080000.64428
Phosphorus (P)7723-14-00.001500.040000.01239
Zinc (Zn)7440-66-60.004860.130000.04027
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51729
Silver (Ag)7440-22-40.060211.610000.49870
subTotal3.74000100.0000030.97521
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.93827
Triphenylphosphine603-35-00.004040.050000.03342
FillerSilica -amorphous-7631-86-95.8104072.0000048.12256
PigmentCarbon black1333-86-40.004040.050000.03342
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.02553
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.68369
subTotal8.07000100.0000066.83689
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.73821
subTotal0.21000100.000001.73926
WirePure metalCopper (Cu)7440-50-80.00417100.000000.03455
subTotal0.00417100.000000.03455
total12.07417100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.