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Chemical content BZT52H-A30-Q

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Type numberPackagePackage descriptionTotal product weight
BZT52H-A30-QSOD123FSOD29.80184 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663003115412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05400100.000000.55092
subTotal0.05400100.000000.55092
Lead FrameCopper alloyCopper (Cu)7440-50-82.8022796.6300028.58922
Iron (Fe)7439-89-60.061772.130000.63019
Phosphorus (P)7723-14-00.000870.030000.00888
Zinc (Zn)7440-66-60.003770.130000.03846
MetallisationSilver (Ag)7440-22-40.031611.090000.32249
subTotal2.90000100.0000029.58924
Mould CompoundFillerSilica fused60676-86-04.7712071.0000048.67658
PigmentCarbon black1333-86-40.020160.300000.20568
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.3238419.7000013.50604
Phenolic resinProprietary0.604809.000006.17027
subTotal6.72000100.0000068.55857
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00006
Non hazardousProprietary0.000070.055500.00068
Tin solderTin (Sn)7440-31-50.1199399.940001.22353
subTotal0.12000100.000001.22427
WirePure metalGold (Au)7440-57-50.00784100.000000.07998
subTotal0.00784100.000000.07998
total9.80184100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.