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Chemical content BZT52H-B39-Q

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Type numberPackagePackage descriptionTotal product weight
BZT52H-B39-QSOD123FSOD29.81777 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664297115212601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000000.71299
subTotal
Lead FrameCopper alloyIron (Fe)7439-89-60.061772.130000.62917
Copper (Cu)7440-50-82.8022796.6300028.54284
Phosphorus (P)7723-14-00.000870.030000.00886
Zinc (Zn)7440-66-60.003770.130000.03840
MetallisationSilver (Ag)7440-22-40.031611.090000.32197
subTotal
Mould CompoundFillerSilica fused60676-86-04.7712071.0000048.59759
PigmentCarbon black1333-86-40.020160.300000.20534
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.3238419.7000013.48412
Phenolic resinProprietary0.604809.000006.16026
subTotal
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00006
Non hazardousProprietary0.000070.055500.00068
Tin solderTin (Sn)7440-31-50.1199399.940001.22154
subTotal
WirePure metalGold (Au)7440-57-50.00777100.000000.07914
subTotal
total9.81777100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.