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Chemical content BZT52H-B3V3

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Type numberPackagePackage descriptionTotal product weight
BZT52H-B3V3SOD123FSOD29.78777 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934064781115812601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000000.40867
subTotal0.04000100.000000.40867
Lead FrameCopper alloyCopper (Cu)7440-50-82.8091796.8680028.70084
Iron (Fe)7439-89-60.061772.130000.63109
Phosphorus (P)7723-14-00.000870.030000.00889
Zinc (Zn)7440-66-60.003770.130000.03852
MetallisationSilver (Ag)7440-22-40.031611.090000.32295
Pure metal layerSilver (Ag)7440-22-40.023780.820000.24296
subTotal2.90000100.0000029.94525
Mould CompoundFillerSilica fused60676-86-04.7712071.0000048.74655
PigmentCarbon black1333-86-40.020160.300000.20597
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.3238419.7000013.52545
Phenolic resinProprietary0.604809.000006.17914
subTotal6.72000100.0000068.65711
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00006
Non hazardousProprietary0.000070.055500.00068
Tin solderTin (Sn)7440-31-50.1199399.940001.22528
subTotal0.12000100.000001.22602
WirePure metalGold (Au)7440-57-50.00777100.000000.07938
subTotal0.00777100.000000.07938
total9.78777100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.