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Chemical content BZX585-B6V8-Q

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Type numberPackagePackage descriptionTotal product weight
BZX585-B6V8-QSOD523SC-791.51727 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667475115112601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000003.29539
subTotal0.05000100.000003.29539
DieDoped siliconSilicon (Si)7440-21-30.02800100.000001.84542
subTotal0.02800100.000001.84542
Lead FrameCopper alloyCopper (Cu)7440-50-80.4579786.4100030.18401
Nickel (Ni)7440-02-00.046488.770003.06346
Tin (Sn)7440-31-50.011872.240000.78246
Pure metal layerSilver (Ag)7440-22-40.013672.580000.90122
subTotal0.53000100.0000034.93115
Mould CompoundFillerSilica fused60676-86-00.6248071.0000041.17922
PigmentCarbon black1333-86-40.002640.300000.17400
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.42578
Phenolic resinProprietary0.079209.000005.21990
subTotal0.88000100.0000057.99890
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00073
Tin solderTin (Sn)7440-31-50.0199999.940001.31737
subTotal0.02000100.000001.31816
WirePure metalGold (Au)7440-57-50.00473100.000000.31165
subTotal0.00473100.000000.31165
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0045499.990000.29939
subTotal0.00454100.000000.29942
total1.51727100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.