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Chemical content BZX585-C2V4

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Type numberPackagePackage descriptionTotal product weight
BZX585-C2V4SOD523SC-791.48454 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340558361351412601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
9340558361151512601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000003.36805
subTotal0.05000100.000003.36805
Lead FrameCopper alloyCopper (Cu)7440-50-80.5177197.6817334.87364
Iron (Fe)7439-89-60.011402.150000.76758
Phosphorus (P)7723-14-00.000180.034000.01214
Zinc (Zn)7440-66-60.000570.108000.03856
ImpurityLead (Pb)7439-92-10.000010.001270.00045
Pure metal layerCopper (Cu)7440-50-80.000030.005000.00179
Silver (Ag)7440-22-40.000110.020000.00714
subTotal0.53000100.0000035.70130
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.08711
PigmentCarbon black1333-86-40.002640.300000.17783
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.67769
Phenolic resinProprietary0.079209.000005.33499
subTotal0.88000100.0000059.27762
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00075
Tin solderTin (Sn)7440-31-50.0199999.940001.34641
subTotal0.02000100.000001.34722
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0045499.990000.30599
subTotal0.00454100.000000.30602
total1.48454100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.