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Chemical content BZX58550-C9V1

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Type numberPackagePackage descriptionTotal product weight
BZX58550-C9V1SOD523SC-791.46860 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662182115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03500100.000002.38322
subTotal0.03500100.000002.38322
Lead FrameCopper alloyCopper (Cu)7440-50-80.4579786.4100031.18433
Nickel (Ni)7440-02-00.046488.770003.16499
Tin (Sn)7440-31-50.011872.240000.80839
Pure metal layerSilver (Ag)7440-22-40.013672.580000.93109
subTotal0.53000100.0000036.08880
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.54392
PigmentCarbon black1333-86-40.002640.300000.17976
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.80444
Phenolic resinProprietary0.079209.000005.39289
subTotal0.88000100.0000059.92101
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00076
Tin solderTin (Sn)7440-31-50.0199999.940001.36102
subTotal0.02000100.000001.36184
WirePure metalGold (Au)7440-57-50.00364100.000000.24786
subTotal0.00364100.000000.24786
total1.46860100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.