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Chemical content BZX84J-B12

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Type numberPackagePackage descriptionTotal product weight
BZX84J-B12SOD323FSOD323F3.78328 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340609381151512601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000001.32160
subTotal
Lead FrameCopper alloyZinc (Zn)7440-66-60.001960.130000.05189
Iron (Fe)7439-89-60.031862.110000.84215
Phosphorus (P)7723-14-00.000450.030000.01197
Copper (Cu)7440-50-81.4745297.6500038.97451
Pure metal layerSilver (Ag)7440-22-40.001210.080000.03193
subTotal
Mould CompoundFillerSilica fused60676-86-01.6071475.1000042.48007
PigmentCarbon black1333-86-40.006420.300000.16969
PolymerPhenol Formaldehyde resin (generic)9003-35-40.151947.100004.01609
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3745017.500009.89882
subTotal
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000040.055500.00117
Tin solderTin (Sn)7440-31-50.0799599.940002.11330
subTotal
WirePure metalCopper (Cu)7440-50-80.00328100.000000.08664
subTotal
total3.78328100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.