Chemical content BZX884S-B13-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-B13-QSOD882BDDFN1006-20.89648 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662709315112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61074
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22190
Phenolic resinProprietary0.0025713.530000.28675
DieDoped siliconSilicon (Si)7440-21-30.03500100.000003.90416
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.12252
Magnesium (Mg)7439-95-40.000590.150000.06609
Nickel (Ni)7440-02-00.011772.980001.31302
Silicon (Si)7440-21-30.002570.650000.28640
Pure metal layerGold (Au)7440-57-50.000040.010000.00441
Nickel (Ni)7440-02-00.002250.570000.25115
Palladium (Pd)7440-05-30.000160.040000.01762
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.76533
Silica fused60676-86-00.3387980.0920037.79104
PigmentCarbon black1333-86-40.003930.928000.43787
PolymerEpoxy resin systemProprietary0.035748.450003.98709
Phenolic resinProprietary0.010792.550001.20321
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00124
Tin solderTin (Sn)7440-31-50.0199999.940002.22961
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49968
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.