Chemical content BZX884S-B24-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-B24-QSOD882BDDFN1006-20.91148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662732315112601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.58424
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.21825
Phenolic resinProprietary0.0025713.530000.28204
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.48558
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.42932
Magnesium (Mg)7439-95-40.000590.150000.06500
Nickel (Ni)7440-02-00.011772.980001.29142
Silicon (Si)7440-21-30.002570.650000.28168
Pure metal layerGold (Au)7440-57-50.000040.010000.00433
Nickel (Ni)7440-02-00.002250.570000.24702
Palladium (Pd)7440-05-30.000160.040000.01733
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.70336
Silica fused60676-86-00.3387980.0920037.16913
PigmentCarbon black1333-86-40.003930.928000.43067
PolymerEpoxy resin systemProprietary0.035748.450003.92148
Phenolic resinProprietary0.010792.550001.18341
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00122
Tin solderTin (Sn)7440-31-50.0199999.940002.19292
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49146
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.