Chemical content BZX884S-B62-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-B62-QSOD882BDDFN1006-20.90400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662761315112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.59735
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22006
Phenolic resinProprietary0.0025713.530000.28437
DieDoped siliconSilicon (Si)7440-21-30.03900100.000004.31416
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.77212
Magnesium (Mg)7439-95-40.000590.150000.06554
Nickel (Ni)7440-02-00.011772.980001.30210
Silicon (Si)7440-21-30.002570.650000.28402
Pure metal layerGold (Au)7440-57-50.000040.010000.00437
Nickel (Ni)7440-02-00.002250.570000.24906
Palladium (Pd)7440-05-30.000160.040000.01748
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.73400
Silica fused60676-86-00.3387980.0920037.47668
PigmentCarbon black1333-86-40.003930.928000.43423
PolymerEpoxy resin systemProprietary0.035748.450003.95393
Phenolic resinProprietary0.010792.550001.19320
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.21106
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0080099.990000.88487
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.